Specification Sheet

PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
61AMD Phenom™ Processor
AMD Phenom™ Processor Thermal and Power Specification Table Notes (Continued):
22.
The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP in this state is measured at Tcase Max and VDD at the voltage requested by the
processor with the number of cores in the C1 state specified by C-State Count. TDP includes all power
dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. Due to increased power density
in the state, the processor has an increased probability of hardware thermal control (HTC) activation
compared to S0.C0.P1 at the same ambient temperature. TDP is not the maximum power of the
processor.
23.
C-State Count indicates the minimum number of cores in the C1 state required for the remaining cores
to enter this P-state. Refer to F4x164[CstateCnt] in the
BIOS and Kernel Developer's Guide (BKDG) for
AMD Family 10h Processors
, order# 31116, for more details about the entry requirements into this
P-state.