Product Datasheet

2
31805 Rev. 3.05 September 2006
AMD Sempron™ Processor Product Data Sheet
939-Pin Package Specific Features
• Refer to the AMD Functional Data Sheet,
939-Pin Package, order# 31411, for functional,
electrical, and mechanical details of 939-pin
package processors
• Packaging
– 939-pin lidded micro PGA
– 1.27-mm pin pitch
– 31x31-row pin array
– 40mm x 40mm organic substrate
– Organic C4 die attach
• Integrated Memory Controller
– Low-latency, high-bandwidth
– 144-bit DDR SDRAM at 100, 133, 166, and
200 MHz
– Supports up to four unbuffered DIMMs
– ECC checking with double-bit detect and single-bit
correct
• Electrical Interfaces
– HyperTransport™ technology: LVDS-like
differential, unidirectional
– DDR SDRAM: SSTL_2 per JEDEC specification
– Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications
Socket AM2 Processor Specific
Features
• Refer to the Socket AM2 Processor Functional
Data Sheet, order# 31117, for functional and
mechanical details of socket AM2 processors.
Refer to the AMD NPT Family 0Fh Processor
Electrical Data Sheet, order# 31119, for
electrical details of socket AM2 processors.
• Packaging
– Lidded micro PGA
– 1.27-mm pin pitch
– 31x31 grid array
– Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in specifically
exempted applications
• Integrated Memory Controller
– Low-latency, high-bandwidth
– 128-bit DDR2 SDRAM controller operating at up
to 333 MHz
– Supports up to four unbuffered DIMMs
• Electrical Interfaces
– HyperTransport™ technology: LVDS-like
differential, unidirectional
– DDR2 SDRAM: SSTL_1.8 per JEDEC
specification
– Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications