AMD Preliminary Information AMD Sempron Processor Model 10 TM Data Sheet Publication # 31993 Rev.
AMD Preliminary Information ©2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table of Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 2 Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 2.2 2.3 2.4 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 7.10 7.11 7.12 7.13 8 8.2 9.3 Die Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 AMD Sempron Processor Model 10 Part Number 27488 OPGA Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 AMD Sempron Processor Model 10 Part Number 27493 OPGA Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Pin Descriptions . . . . . . . . . . . . . . . .
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet PGA Orientation Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 PLL Bypass and Test Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 72 PWROK Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 SADDIN[1:0]# and SADDOUT[1:0]# Pins . . . . . . . . . . . . . 73 Scan Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 SMI# Pin .
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet vi 31993A-1 September 2004 Table of Contents
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet List of Figures Figure 1. Typical AMD Sempron™ Processor Model 10 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 2. Logic Symbol Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 3. AMD Sempron Processor Model 10 Power Management States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet viii 31993A-1 September 2004 List of Figures
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet List of Tables Table 1. Electrical and Thermal Specifications for the Advanced 333 FSB AMD Sempron™ Processor Model 10 . . . . . . . . . . . . . 21 Table 2. 333 FSB SYSCLK and SYSCLK# AC Characteristics . . . . . . . . . 22 Table 3. 333 FSB AMD Athlon™ System Bus AC Characteristics . . . . . . 23 Table 4. 333 FSB AMD Athlon System Bus DC Characteristics . . . . . . . . 24 Table 5.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet x 31993A-1 September 2004 List of Tables
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Revision History Date September 2004 Revision History Rev A-1 Description ■ Initial release of the AMD Sempron™ processor model 10 data sheet.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet xii 31993A-1 September 2004 Revision History
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 1 Overview The AMD Sempron™ processor model 10 with QuantiSpeed™ architecture powers the next generation in computing platforms, delivering extreme performance for Windows® XP. The AMD Sempron processor model 10, based on leading-edge 0.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 performance, full-speed, on-chip cache, an advanced 333 FSB with a 2.7-Gigabyte per second system bus, and 3DNow!™ Professional technology. The AMD Athlon system bus combines the latest technological advances, such as point-to-point topology, source-synchronous packet-based transfers, and low-voltage signaling to provide an extremely powerful, scalable bus for an x86 processor.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 The AMD Sempron processor model 10 delivers excellent system performance in a cost-effective, industry-standard form factor. The AMD Sempron processor model 10 is compatible with motherboards based on Socket A. Figure 1 shows a typical AMD Sempron processor model 10 system block diagram.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 4 31993A-1 September 2004 Overview Chapter 1
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 2 Interface Signals Chapter 2 discusses the AMD Athlon™ system bus architecture, design, and signal support that is used in the AMD Sempron™ processor model 10. 2.1 Overview The AMD Athlon system bus architecture is designed to deliver excellent data movement bandwidth for next-generation x86 platforms as well as the high-performance required by enterprise-class application software.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 2.3 31993A-1 September 2004 Push-Pull (PP) Drivers The AMD Sempron processor model 10 supports push-pull (PP) drivers. The system logic configures the processor with the configuration parameter called SysPushPull (1=PP). The impedance of the PP drivers is set to match the impedance of the motherboard by two external resistors connected to the ZN and ZP pins. See “ZN and ZP Pins” on page 74 for more information. 2.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 3 Logic Symbol Diagram Figure 2 is the logic symbol diagram of the processor. This diagram shows the logical grouping of the input and output signals.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 8 Logic Symbol Diagram 31993A-1 September 2004 Chapter 3
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 4 Power Management This chapter describes the power management control system o f t h e A M D S e m p ron p ro c e s so r m o d el 1 0 . The p owe r management features of the processor are compliant with the ACPI 1.0b and ACPI 2.0 specifications. 4.1 Power Management States The AMD Sempron processor model 10 supports low-power Halt and Stop Grant states.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 The following sections provide an overview of the power m a n a g e m e n t s t a t e s . Fo r m o re d e t a i l s , re f e r t o t h e AMD Athlon™ and AMD Duron™ System Bus Specification, order# 21902. Note: In all power management states that the processor is powered, the system must not stop the system clock (SYSCLK/SYSCLK#) to the processor.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet must first connect the system bus. Connecting the system bus places the processor into the higher power probe state. After the Northbridge has completed all probes of the processor, the Northbridge must disconnect the AMD Athlon system bus again so that the processor can return to the low-power state.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 In C2, probes are allowed, as shown in Figure 3 on page 9 The Stop Grant state is also entered for the S1, Powered On Suspend, system sleep state based on a write to the SLP_TYP and SLP_EN fields in the ACPI-defined Power Management 1 control register in the Southbridge. During the S1 Sleep state, system software ensures no bus master or probe activity occurs.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet interrupt for Halt or STPCLK# deassertion. Reconnect is initiated by the Northbridge to probe the processor. The Northbridge contains BIOS programmable registers to enable the system bus disconnect in response to Halt and Stop Grant special cycles.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Figure 4 shows STPCLK# assertion resulting in the processor in the St op Gra nt st ate and the A MD A thlon system bus disconnected. STPCLK# AMD Athlon™ System Bus Stop Grant CONNECT PROCRDY CLKFWDRST Stop Grant PCI Bus Figure 4. AMD Athlon™ System Bus Disconnect Sequence in the Stop Grant State An example of the AMD Athlon system bus disconnect sequence is as follows: 1.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet Figure 5 shows the signal sequence of events that takes the processor out of the Stop Grant state, connects the processor to the AMD Athlon system bus, and puts the processor into the Working state. Figure 5. Exiting the Stop Grant State and Bus Connect Sequence The following sequence of events removes the processor from the Stop Grant state and connects it to the system bus: 1.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Connect State Diagram 31993A-1 September 2004 Figure 6 below and Figure 7 on page 17 show the Northbridge and processor connect state diagrams, respectively. . Condition Action 1 A disconnect is requested and probes are still pending. 2 A disconnect is requested and no probes are pending. A Deassert CONNECT eight SYSCLK periods after last SysDC sent. 3 A Connect special cycle from the processor. B Assert CLKFWDRST.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Connect 6/B 1 2/B Connect Pending 2 Disconnect Pending 5 Connect Pending 1 3/A Disconnect 4/C Condition 1 Action CONNECT is deasserted by the Northbridge (for a previously sent Halt or Stop Grant special cycle). Processor receives a wake-up event and must cancel 2 the disconnect request. 3 Deassert PROCRDY and slow down internal clocks. 4 Processor wake-up event or CONNECT asserted by Northbridge.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 4.3 31993A-1 September 2004 Clock Control The processor implements a Clock Control (CLK_Ctl) MSR (address C001_001Bh) that determines the internal clock divisor when the AMD Athlon system bus is disconnected. Refer to the AMD Athlon™ and AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656, for more details on the CLK_Ctl register.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 5 CPUID Support AMD Sempron™ processor model 10 version and feature set recognition can be performed through the use of the CPUID instruction, that provides complete information about the processor—vendor, type, name, etc., and its capabilities. Software can make use of this information to accurately tune the system for maximum performance and benefit to users.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 20 CPUID Support 31993A-1 September 2004 Chapter 5
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 6 333 FSB AMD Sempron™ Processor Model 10 Specifications This chapter describes the electrical specifications that are u n i q u e t o t h e a dva n c e d 3 3 3 f ro n t - s i d e b u s ( F S B ) AMD Sempron™ Processor Model 10. 6.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 6.2 31993A-1 September 2004 333 FSB AMD Sempron™ Processor Model 10 SYSCLK and SYSCLK# AC Characteristics Table 2 shows the SYSCLK/SYSCLK# differential clock AC characteristics of this processor. Table 2. 333 FSB SYSCLK and SYSCLK# AC Characteristics Symbol Parameter Description Minimum Maximum Units Notes 50 166 MHz 1 30% 70% 2, 3 Clock Frequency Duty Cycle t1 Period 6 ns t2 High Time 1.0 ns t3 Low Time 1.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 6.3 333 FSB AMD Athlon™ System Bus AC Characteristics The AC characteristics of the AMD Athlon system bus of this processor are shown in Table 3. The parameters are grouped based on the source or destination of the signals involved. Table 3.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 6.4 31993A-1 September 2004 333 FSB AMD Athlon™ System Bus DC Characteristics Table 4 shows the DC characteristics of the AMD Athlon system bus for this processor. Table 4. 333 FSB AMD Athlon™ System Bus DC Characteristics Symbol VREF Parameter Condition Min Max (0.5 x VCC_CORE) (0.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 7 Electrical Data This chapter describes the electrical characteristics that apply to all desktop AMD Sempron™ processors model 10. 7.1 Conventions The conventions used in this chapter are as follows: ■ ■ 7.2 Current specified as being sourced by the processor is negative. Current specified as being sunk by the processor is positive.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Table 5.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 7.4 Frequency Identification (FID[3:0]) Table 7 shows the FID[3:0] DC characteristics. For more information, see “FID[3:0] Pins” on page 70. Table 7. FID[3:0] DC Characteristics Parameter Description Min Max IOL Output Current Low 6 mA VOH Output High Voltage – 2.625 V 1 | VOH – VCC_CORE | ≤ 1.60 V 2 Note: 1. The FID pins must not be pulled above 2.625 V, which is equal to 2.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 7.7 31993A-1 September 2004 VCC_CORE Characteristics Table 9 shows the AC and DC characteristics for VCC_CORE. See Figure 9 on page 29 for a graphical representation of the VCC_CORE waveform. Table 9.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Figure 9 shows the processor core voltage (V C C_C ORE ) waveform response to perturbation. The tMIN_AC (negative AC transient excursion time) and tMAX_AC (positive AC transient excursion time) represent the maximum allowable time below or above the DC tolerance thresholds. tmax_AC VCC_CORE_AC_MAX VCC_CORE_DC_MAX VCC_CORE_NOM VCC_CORE_DC_MIN VCC_CORE_AC_MIN tmin_AC ICORE_MAX dI /dt ICORE_MIN Figure 9.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 7.8 31993A-1 September 2004 Absolute Ratings The AMD Sempron processor model 10 should not be subjected to conditions exceeding the absolute ratings, as such conditions can adversely affect long-term reliability or result in functional damage. Table 10 lists the maximum absolute ratings of operation for the AMD Sempron processor model 10. Table 10.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 7.9 SYSCLK and SYSCLK# DC Characteristics Table 11 shows the DC characteristics of the SYSCLK and SYSCLK# differential clocks. The SYSCLK signal represents CLKIN and RSTCLK tied together while the SYSCLK# signal represents CLKIN# and RSTCLK# tied together.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 7.10 31993A-1 September 2004 General AC and DC Characteristics Table 12 shows the AMD Sempron processor model 10 AC and DC characteristics of the Southbridge, JTAG, test, and miscellaneous pins. Table 12.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 12. General AC and DC Characteristics (continued) Symbol Parameter Description Condition Min Max Units Notes 6.1 ns 5 TDELAY Output Delay with respect to RSTCLK 0.0 TBIT Input Time to Acquire 20.0 ns 7, 8 TRPT Input Time to Reacquire 40.0 ns 9–13 TRISE Signal Rise Time 1.0 3.0 V/ns 6 TFALL Signal Fall Time 1.0 3.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 7.11 31993A-1 September 2004 Open Drain Test Circuit Figure 11 is a test circuit that may be used on automated test equipment (ATE) to test for validity on open-drain pins. Refer to Table 12, “General AC and DC Characteristics,” on page 32 for timing requirements. VTermination1 50 Ω ±3% Open-Drain Pin IOL = Output Current2 Notes: 1. VTermination = 1.2 V for VID and FID pins VTermination = 1.0 V for APIC pins 2.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 7.12 Thermal Diode Characteristics The AMD Sempron processor model 10 provides a diode that can be used in conjunction with an external temperature sensor to determine the die temperature of the processor. The diode anode (THERMDA) and cathode (THERMDC) are available as pins on the processor, as described in “THERMDA and THERMDC Pins” on page 73.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Thermal limits in motherboard design are necessary to protect the processor from thermal damage. T S HU TD OW N is the temperature for thermal protection circuitry to initiate shutdown of the processor. T SD_DELAY is the maximum time allowed from the detection of the over-temperature condition to processor shutdown to prevent thermal damage to the processor.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 7.13 APIC Pins AC and DC Characteristics Table 15 shows the AMD Sempron processor model 10 AC and DC characteristics of the APIC pins. Table 15. APIC Pin AC and DC Characteristics Symbol Parameter Description Condition Min Max Units Notes 1.7 2.625 V 1, 2 | VIH – VCC_CORE | ≤ 1.60 V V 3 700 mV 1 2.625 V 2 | VOH – VCC_CORE | ≤ 1.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 38 Electrical Data 31993A-1 September 2004 Chapter 7
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 8 Signal and Power-Up Requirements The AMD Sempron™ processor model 10 is designed to provide functional operation if the voltage and temperature parameters are within the limits of normal operating ranges. 8.1 Power-Up Requirements Signal Sequence and Timing Description Figure 12 shows the relationship between key signals in the system during a power-up sequence.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Power-Up Timing Requirements. The signal timing requirements are as follows: 1. RESET# must be asserted before PWROK is asserted. The AMD Sempron processor model 10 does not set the correct clock multiplier if PWROK is asserted prior to a RESET# assertion. It is recommended that RESET# be asserted at least 10 nanoseconds prior to the assertion of PWROK.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet clock must be valid at this time. The system clocks are designed to be running after 3.3 V has been within specification for three milliseconds. 4. PWROK assertion to deassertion of RESET# The duration of RESET# assertion during cold boots is intended to satisfy the time it takes for the PLL to lock with a less than 1 ns phase error.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Clock Multiplier Selection (FID[3:0]) 31993A-1 September 2004 The chipset samples the FID[3:0] signals in a chipset-specific manner from the processor and uses this information to determine the correct serial initialization packet (SIP).
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 9 Mechanical Data Th e A MD S e m p ron ™ p roc es s o r m o d e l 10 c o n ne c t s t o themotherboard through a Pin Grid Array (PGA) socket named Socket A. This processor utilizes the Organic Pin Grid Array (OPGA) package type described in this chapter. For more information, see the AMD Athlon™ Processor-Based Motherboard Design Guide, order# 24363. 9.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 9.2 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Part Number 27488 OPGA Package Dimensions Table 17 shows the part number 27488 OPGA package dimensions in millimeters assigned to the letters and symbols used in the 27488 package diagram, Figure 13 on page 45. Table 17. Dimensions for the AMD Sempron™ Processor Model 10 Part Number 27488 OPGA Package Letter or Symbol D/E Minimum Maximum Dimension1 Dimension1 49.27 49.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet Figure 13.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 9.3 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Part Number 27493 OPGA Package Dimensions Table 18 shows the part number 27493 OPGA package dimensions in millimeters assigned to the letters and symbols shown in the 27493 package diagram, Figure 14 on page 47. Table 18. Dimensions for the AMD Sempron™ Processor Model 10 Part Number 27493 OPGA Package Letter or Symbol D/E Minimum Maximum Dimension1 Dimension1 49.27 49.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet Figure 14.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 48 Mechanical Data 31993A-1 September 2004 Chapter 9
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 10 Pin Descriptions This chapter includes pin diagrams of the organic pin grid array (OPGA) for the AMD Sempron™ processor model 10, a listing of pin name abbreviations, and a cross-referenced listing of pin locations to signal names. 10.1 Pin Diagram and Pin Name Abbreviations Figure 15 on page 50 shows the staggered Pin Grid Array (PGA) for the AMD Sempron™ processor model 10.
50 Pin Descriptions Z X V T R P AK AN AM AL 1 INTR IGNNE# FERR A20M# STPC# DBRDY FID[2] FID[0] TDI SCNCK1 TCK PICCLK VID[0] SAO#0 SAO#10 SAO#11 SAO#7 1 2 VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS 2 3 3 NMI FLUSH# INIT# RESET# PWROK PLTST# DBREQ# FID[3] FID[1] TRST# SCNINV TMS PICD#0 VID[1] SAO#1 SAO#14 SAOC# SAO#9 SAO#12 4 VSS VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC
Chapter 10 8 6 4 2 10 Pin Descriptions 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 C C A SD#41 SD#42 SD#43 SD#45 SD#38 SD#47 SD#37 SD#56 SD#59 SD#60 SD#51 NC SDOC#3 SD#54 SAO#2 SAO#8 SAO#9 SAO#7 SDOC#1 B VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS VCC VSS B SD#30 SD#40 SDOC#2 NC SD#44 SD#34 SD#35 SD#39 SD#57 NC SD#62 SD#63 SD#53 SD#61 SD#55 SAO#3 SAO#5 SAO#12 A D VSS VSS VCC VSS VCC VSS VCC VSS V
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Table 19. Pin Name Abbreviations Abbreviation 31993A-1 September 2004 Table 19.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 19. Pin Name Abbreviations (continued) Abbreviation Chapter 10 Full Name Pin Table 19.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Table 19. Pin Name Abbreviations (continued) Abbreviation Full Name Pin 31993A-1 September 2004 Table 19.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 19. Pin Name Abbreviations (continued) Abbreviation Full Name Table 19.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Table 19. Pin Name Abbreviations (continued) Abbreviation VCC Full Name VCC_CORE Pin F24 VCC VCC_CORE VCC 31993A-1 September 2004 Table 19.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 19. Pin Name Abbreviations (continued) Abbreviation VCC Full Name VCC_CORE Pin AK34 VCC VCC_CORE VCC Table 19.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet Table 19. Pin Name Abbreviations (continued) Abbreviation 58 Full Name Pin 31993A-1 September 2004 Table 19.
AMD Preliminary Information 31993A-1 September 2004 10.2 AMD Sempron™ Processor Model 10 Data Sheet Pin List Table 20 on page 60 cross-references Socket A pin location to signal name. The “L” (Level) column shows the electrical specification for this pin. “P” indicates a push-pull mode driven by a single source. “O” indicates open-drain mode that allows devices to share the pin. Note: The AMD Sempron processor supports push-pull drivers. For more information, see “Push-Pull (PP) Drivers” on page 6.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location Pin Name Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued) Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued)Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued)Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued)Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued)Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued)Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 20. Cross-Reference by Pin Location (continued)Table 20.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 10.3 Detailed Pin Descriptions The information in this section pertains to Table 20 on page 60. A20M# Pin A20M# is an input from the system used to simulate address wrap-around in the 20-bit 8086. AMD Pin AMD Socket A processors do not implement a pin at location AH6. All Socket A designs must have a top plate or cover that blocks this pin location.
AMD Preliminary Information 31993A-1 September 2004 CLKIN, RSTCLK (SYSCLK) Pins AMD Sempron™ Processor Model 10 Data Sheet Connect CLKIN with RSTCLK and name it SYSCLK. Connect CLKIN# with RSTCLK# and name it SYSCLK#. Length match the clocks from the clock generator to the Northbridge and processor. See “SYSCLK and SYSCLK#” on page 73 for more information. CONNECT Pin CONNECT is an input from the system used for power management and clock-forward initialization at reset.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet FID[3:0] Pins 31993A-1 September 2004 FID[3] (Y3), FID[2] (Y1), FID[1] (W3), and FID[0] (W1) are the 4-bit processor clock-to-SYSCLK ratio. Table 21 describes the encodings of the clock multipliers on FID[3:0]. Table 21. FID[3:0] Clock Multiplier Encodings FID[3:0]2 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Processor Clock to SYSCLK Frequency Ratio 11 11.5 12 ≥ 12.51 5 5.5 6 6.5 7 7.5 8 8.5 9 9.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 signals High above 2.5 V. Do not expose these pins to a differential voltage greater than 1.60 V, relative to the processor core voltage. Refer to “VCC_2.5V Generation Circuit” found in the section, “Motherboard Required Circuits,” of the AMD Athlon™ Processor Motherboard Design Guide, order# 24363 for the required supporting circuitry.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 INTR Pin INTR is an input from the system that causes the processor to start an interrupt acknowledge transaction that fetches the 8-bit interrupt vector and starts execution at that location. JTAG Pins TCK, TMS, TDI, TRST#, and TDO are the JTAG interface. Connect these pins directly to the motherboard debug connector. Pull TDI, TCK, TMS, and TRST# up to VCC_CORE with pullup resistors.
AMD Preliminary Information 31993A-1 September 2004 PWROK Pin AMD Sempron™ Processor Model 10 Data Sheet The PWROK input to the processor must not be asserted until all voltage planes in the system are within specification and all system clocks are running within specification. For more information, Chapter 8, “Signal and Power-Up Requirements” on page 39. SADDIN[1:0]# and SADDOUT[1:0]# Pins The AMD Sempron processor model 10 does not support SADDIN[1:0]# or SADDOUT[1:0]#.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet VID[4:0] Pins 31993A-1 September 2004 The VID[4:0] (Voltage Identification) outputs are used to dictate the V CC_CORE voltage level. The VID[4:0] pins are strapped to ground or left unconnected on the processor package. The VID[4:0] pins are pulled up on the motherboard and used by the VCC_CORE DC/DC converter. The VID codes and corresponding voltage levels are shown in Table 23. Table 23.
AMD Preliminary Information 31993A-1 September 2004 AMD Sempron™ Processor Model 10 Data Sheet SysPushPull asserted), ZN is tied to VCC_CORE with a resistor that has a resistance matching the impedance Z 0 of the transmission line. ZP is tied to VSS with a resistor that has a resistance matching the impedance Z0 of the transmission line.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 76 Pin Descriptions 31993A-1 September 2004 Chapter 10
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 11 Ordering Information Standard AMD Sempron™ Processor Model 10 Products AMD standard products are available in several operating ranges. The ordering part numbers (OPN) are formed by a combination of the elements, as shown in Figure 17. OPN1 SD A 3000 D U T 4 D Advanced Front-Side Bus: D = 333 Size of L2 Cache: 4 = 512 Kbytes Die Temperature: T = 90°C Operating Voltage: U = 1.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 78 Ordering Information 31993A-1 September 2004 Chapter 11
AMDAMD Confidential—Advance Information Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Appendix A Thermal Diode Calculations This section contains information about the calculations for the on-die thermal diode of the AMD Sempron™ processor model 10. For electrical information about this thermal diode, see Table 13, “Thermal Diode Electrical Characteristics,” on page 35.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Equation (1) shows the ideal diode calculation. k I V BE = n f, lumped ⋅ --- ⋅ T ⋅ ln ⎛⎝ ---C-⎞⎠ IS q (1) Sourcing two currents and using Equation (1) derives the difference in the base-to-emitter voltage that leads to finding the diode temperature as shown in Equation (2).
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 The formulas in Equation (3) and Equation (4) can be used to calculate the temperature offset for temperature sensors that do not employ series resistance cancellation. The result is added to the value measured by the temperature sensor. Contact the vendor of the temperature sensor being used for the value of nf,TS. Refer to the document, On-Die Thermal Diode Characterization, order# 25443, for further details.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 82 31993A-1 September 2004 Appendix A - Thermal Diode Calculations
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Appendix B Conventions and Abbreviations This section contains information about the conventions and abbreviations used in this document. Signals and Bits ■ ■ ■ ■ ■ Active-Low Signals — Signal names containing a pound sign, such as SFILL#, indicate active-Low signals. They are asserted in their Low-voltage state and negated in their High-voltage state.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Data Terminology The following list defines data terminology: ■ ■ ■ ■ ■ ■ ■ 84 Quantities • A word is two bytes (16 bits) • A doubleword is four bytes (32 bits) • A quadword is eight bytes (64 bits) Addressing—Memory is addressed as a series of bytes on eight-byte (64-bit) boundaries in which each byte can be separately enabled.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Abbreviations and Acronyms Table 26 contains the definitions of abbreviations used in this document. Table 26.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 26. Abbreviations (continued) Abbreviation Meaning pF picofarad pH picohenry ps picosecond s Second V Volt W Watt Table 27 contains the definitions of acronyms used in this document. Table 27.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 27.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Table 27.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 31993A-1 September 2004 Related Publications These documents provide helpful information about the AMD Sempron™ processor model 10, and can be found with o t h e r re l a t e d d o c u m e n t s a t t h e A M D We b s i t e , http://www.amd.com.
AMD Preliminary Information AMD Sempron™ Processor Model 10 Data Sheet 90 31993A-1 September 2004 Appendix B - Conventions and Abbreviations
