Product Datasheet

3
AMD Opteron™ Processor Product Data Sheet
23932 Rev. 3.19 September 2006
Socket F (1207) Specific Features
• Refer to the AMD Functional Data Sheet,
L1 Package, order# 31118 for functional and
mechanical details of socket F (1207)
processors.
• Refer to the AMD NPT 0Fh Family Processor
Electrical Data Sheet, order# 31119 for
electrical details of socket F (1207)
processors
• Electrical Interfaces
– HyperTransport™ technology: LVDS-Like
differential, unidirectional
– DDR SDRAM: SSTL_2 per JEDEC specification
– Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications
• Packaging
– Lidded Lan Grid Array package
– 35 x 35 grid array
– Compliant with RoHS (EU Directive 2002/95/EC)
with lead used only in small amounts in
specifically exempted applications
• Integrated Memory Controller
– Low-latency, high-bandwidth
– 144-bit DDR SDRAM at up to 333 MHz
– Supports up to eight registered DIMMs
– ECC checking with double-bit detect and single-
bit correct
– On-line spare feature provides single-rank DRAM
redundancy
• HyperTransport™ Technology to I/O Devices
– Three links, 16-bits in each direction, each
supports up to 2000 MT/s or 4.0 GB/s in each
direction (2000MT/s supported by Rev E and later)
– Each link on uniprocessor (UP) models supports
connections to I/O devices.
– Each link on dual-processor (DP) models supports
connections to I/O devices, and any one of the three
available links may connect to another DP or MP
processor.
– Each link on multiprocessor (MP) models supports
connections to I/O devices or other DP or MP
processors.