Specifications

E PENTIUM® PRO PROCESSOR AT 150, 166, 180, and 200 MHz
81
1.85" Total
Clearance
Above Socket
0.4" MIN
Surface Mount
Component
Fan/Heatsink
OverDrive
Voltage
Regulator
Module
Package
A
B
Socket 8
Heat Sink clip
"Keep out Zone"
6 places
0.1"0.1"
NOTE:
Do Not Interfere
with ZIF Handle
Operation
Socket
Airspace
TPH
0.3"
Above
Fan
ALL
four
sides
0.2"
MIN
0.2"
MIN
R
Figure 48. Space Requirements for the OverDrive
®
Processor
Immovable objects must not be located less than
1.85 inches above the seating plane of the ZIF
socket. Removable objects must also not be located
less than the 1.85 inches above the seating plane of
the ZIF socket required for the processor and
fan/heatsink. These requirements also apply to the
area above the cam shelf.
As shown in Figure 48 it is acceptable to allow any
device (i.e. add-in cards, surface mount device,
chassis etc.) to enter within the free space distance
of 0.2" from the chip package if it is not taller than the
level of the heat sink base. In other words, if a
component is taller than height 'B', it cannot be closer
to the chip package than distance 'A'. This applies to
all four sides of the chip package (the handle side of
the ZIF socket will generally meet this specification
since its width is typically larger than distance 'A'
(0.2").
For designs which use Header 8, the header itself
can violate the 0.2” airspace around the OverDrive
processor package. A VRM (either Pentium Pro
processor VRM or OverDrive VRM), once installed in
Header 8, and any components on the module,
MUST NOT violate the 0.2” airspace. Also, the