Specifications

PENTIUM® PRO PROCESSOR AT 150, 166, 180, and 200 MHz E
80
8.2.2.2. Socket 8 Space Requirements
The OverDrive processor will be equipped with a
fan/heatsink thermal management device. The
package envelope dimensions for the OverDrive
processor with attached fan/heatsink are shown in
Figure 47. Clearance is required around the
fan/heatsink to ensure unimpeded air flow for proper
cooling (refer to Section 8.5.1.1. for details).
Figure 48 shows the Socket 8 space requirements
for the OverDrive processor. All dimensions are in
inches.
“Keep out zones,” also shown in Figure 48, have
been established around the heat sink clip
attachment tabs to prevent damage to surface
mounted components during clip installation and
removal. The keep out zones extend upwards from
the surface of the motherboard to the top of the heat
sink. The lateral limits of the keep out zones extend
0.1 inch from the perimeter of each tab.
2.46"
3.23"
0.58"
0.50"
1.45"
TOP VIEWEND VIEW
SIDE VIEW
Pin A1
KEEP OUT ZONES
NOT SHOWN
Figure 47. OverDrive
®
Processor Envelope Dimensions