Specifications

PPC405EP – PowerPC 405EP Embedded Processor
12 AMCC
Revision 1.08 – March 24, 2008
Data Sheet
Figure 2. 31mm, 385-Ball E-PBGA Package
A
s
1.27 TYP
0.65 ± 0.05 SOLDERBALL x 385
31.0 ± 0.2
27.98
31.0
B
A
C
0.20
∅ 0.30
∅ 0.15
s
C
A
B
s
s
15.5 TYP
Gold Gate Release
Corresponds to
0.20
C
C
2.36 REF
0.6
±0.1
PCB
Substrate
Mold
Compound
B
C
D
E
F
G
H
J
K
L
M
AA
N
P
R
T
U
V
W
Y
AB
AC
Thermal Balls
A01 Ball Location
01 03 05
07
09 11 13 15 17
19
02
04
06
08 10
12 14
16 18
21 23
20
22
Top View
Bottom View
0.25
0.35
C
C
Notes: 1. All dimensions are in mm.
2.65 max
2. Package available in leaded and lead-free configurations.
2.07 min
Logo View
®
PPC405EP
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Lot Number
Part Number