Specifications

405GP – Power PC 405GP Embedded Processor
16 AMCC
Revision 2.01 – January 6, 2005
Data Sheet
35mm, 456-Ball E-PBGA Package
A
M
1.27
0.75 ± 0.15 SOLDERBALL x 456
26
AF
35.0
31.75
35.0
B
A
C
0.20
∅ 0.30
∅ 0.15
C
A
B
30.0 Typ
Gold Gate Release
Corresponds to
Reserved Area for Ejector Pin Mark x 4 TYP
Corner Shape is Chamferred or Rounded
0.20
C
C
0.6±0.1
PCB
Substrate
Mold
Compound
B
C
D
E
F
G
H
J
K
L
M
AA
N
P
R
T
U
V
W
Y
AB
AC
AD
AE
Thermal Balls
A1 Ball Location
135
7
911131517
19
2
4
6
810
12 14
16 18
21 23
25
20
22
24
Top View
Bottom View
0.25
0.35
C
C
Notes: 1. All dimensions are in mm.
2.65 max
M
2. This package is available in leaded or lead-free configurations.