Specifications

2–14 Chapter 2: Board Components
Configuration, Status, and Setup Elements
Cyclone III 3C120 Development Board Reference Manual © March 2009 Altera Corporation
Ta bl e 2–6 lists the MAX II component reference and manufacturing information.
Configuration, Status, and Setup Elements
This section describes the board’s configuration, status, and setup elements, and is
divided into the following groups:
■ “Configuration” on page 2–15
■ FPGA programming over USB
■ FPGA programming from flash memory
■ Flash programming over USB
■ “Status Elements” on page 2–17
■ Board-specific LEDs
■ Power display
■ “Setup Elements” on page 2–18
■ JTAG control DIP switch
■ MAX II device control DIP switch
■ System reset and configuration push buttons
■ POWER SELECT rotary switch
■ PGM CONFIG SELECT rotary switch
■ Speaker header
C16 — Power VCCIO3
H11 — Power VCCIO3
J11 — Power VCCIO3
P16 — Power VCCIO3
L8 — Power VCCIO4
L9 — Power VCCIO4
T3 — Power VCCIO4
T14 — Power VCCIO4
P15 1.8 V Input VOLTS_WATTS
Note to Table 2–5:
(1) For more information about the MAX II pin-out, refer to the Altera website at www.altera.com/literature/lit-dp.jsp.
Table 2–5. MAX II Device Pin-Out (Note 1) (Part 8 of 8)
MAX II Pin Number I/O Standard Signal Direction
Schematic
Signal Name
Table 2–6. MAX II Component Reference and Manufacturing Information
Board
Reference Description Manufacturer
Manufacturing
Part Number
Manufacturer
Website
U7 256-pin device in a FineLine Ball Grid
Array (FBGA) package
Altera Corporation EPM2210GF256C3N www.altera.com