Datasheet

Thermal Characteristics
Table 7: Thermal Characteristics
Parameter/Condition Value Units Symbol Notes
Operating case temperature -
Commercial
0 to +85 °C T
C
1, 2, 3
0 to +95 °C T
C
1, 2, 3, 4
Operating case temperature -
Industrial
–40 to +85 °C T
C
1, 2, 3
–40 to +95 °C T
C
1, 2, 3, 4
Junction-to-case (TOP) Die Rev A
78-ball “SN” 3.2
°C/W ΘJC 5
96-ball “HA” 3.0
Notes:
1. MAX operating case temperature. T
C
is measured in the center of the package.
2. A thermal solution must be designed to ensure the DRAM device does not exceed the
maximum T
C
during operation.
3. Device functionality is not guaranteed if the DRAM device exceeds the maximum T
C
dur-
ing operation.
4. If T
C
exceeds 85°C, the DRAM must be refreshed externally at 2x refresh, which is a 3.9μs
interval refresh rate. The use of SRT or ASR (if available) must be enabled.
5. The thermal resistance data is based off of a number of samples from multiple lots and
should be viewed as a typical number.
Figure 10: Thermal Measurement Point
(L/2)
L
W
(W/2)
T
c
test point
8Gb: x4, x8, x16 DDR3L SDRAM
Thermal Characteristics
26
Rev.2.0 June 2016
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