Datasheet
Absolute Maximum DC Ratings
NOTE :
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those indi-
cated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement
conditions, please refer to JESD51-2 standard.
3. V
DD and VDDQ must be within 300mV of each other at all times;and VREF must be not greater than 0.6 x VDDQ,
When V
DD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV.
Operating Temperature Condition
NOTE :
1. Operating temperature is the case surface temperature on the center/top side of the DRAM.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During
operation, the DRAM case temperature must be maintained between 0°C to +85°C under all operating conditions.
3. Some applications require operation of the DRAM in the Extended Temperature Range between +85°C and +95°C
case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply:
a) Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9μs.
(This double refresh requirement may not apply for some devices.)
b) If Self-refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the
Manual Self-Refresh mode with Extended Temperature Range capability (MR2 bit [A6, A7] = [0, 1]) or enable the
optional Auto Self-Refresh mode (MR2 bit [A6, A7] = [1, 0]).
Recommended DC Operating Conditions
NOTE :
1. Under all conditions VDDQ must be less than or equal to VDD.
2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
Symbol Parameter Rating Units Notes
V
DD Voltage on VDD pin relative to Vss -0.4 V ~ 1.975 V V 1,3
VDDQ Voltage on VDDQ pin relative to Vss -0.4 V ~ 1.975 V V 1,3
VIN, VOUT Voltage on any pin relative to Vss -0.4 V ~ 1.975 V V 1
T
STG
Storage Temperature -55 to +100 °C 1,2
Symbol Parameter
Rating
Units NotesMin. Typ. Max.
V
DD Supply voltage 1.425 1.5 1.575 V 1,2
VDDQ Supply voltage for Output 1.425 1.5 1.575 V 1,2
AS4C256M16D3B-12BIN
AS4C256M16D3B-12BCN
Confidential
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Rev.1.1 April 2017
Symbol Parameter Rating Units Notes
T
C
Operating case temperature (Commercial )
0 to +95 °C 1,2,3
T
C
Operating case temperature (Industrial)
-40 to +95
°C 1,2,3