User's Manual

ALXC2X DATASHEET
Alinket Proprietary & Confidential Information
E-mail: [e-mail] Website: http://www.alinket.com
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List of Contents
1. INTRODUCTION ................................................................................................................................. 8
1.1 ALXC2X MODULE OVERVIEW............................................................................................................... 8
1.2 FEATURES ........................................................................................................................................... 8
2. PIN ASSIGNMENT ............................................................................................................................ 10
2.1 PIN CONFIGURATION ......................................................................................................................... 10
2.2 PIN DEFINITIONS .............................................................................................................................. 11
3. MICROCONTROLLER SUBSYSTEM .................................................................................................... 12
3.1 ARM CORTEX-M4 WITH FPU CORE WITH EMBEDDED FLASH AND SRAM................................................. 12
3.2 EMBEDDED FLASH MEMORY ............................................................................................................... 12
3.3 EMBEDDED SRAM ............................................................................................................................ 12
3.4 NRST .............................................................................................................................................. 12
3.5 UART INTERFACE .............................................................................................................................. 12
3.6 SERIAL PERIPHERAL INTERFACE (SPI) .................................................................................................... 12
3.7 UNIVERSAL SERIES BUS (USB) ............................................................................................................. 13
3.8 INTER-INTEGRATED SOUND (I2S) ......................................................................................................... 13
3.9 INTER-INTEGRATED CIRCUIT INTERFACE (I2C) ......................................................................................... 14
3.10 ANALOG-TO-DIGITAL CONVERTER (ADC) ............................................................................................... 14
3.11 GENERAL-PURPOSE INPUT/OUTPUTS (GPIOS) ....................................................................................... 14
3.12 JTAG DEBUG PORT (SWJ-DP) ............................................................................................................ 14
4. SPECIFICATION ................................................................................................................................ 15
4.1 GENERAL SPECIFICATION .................................................................................................................... 15
4.2 VOLTAGES......................................................................................................................................... 15
4.3 TEMPERATURE AND HUMIDITY ............................................................................................................. 15
5. WI-FI RF SPECIFICATION .................................................................................................................. 16
5.1 RF SPECIFICATION ............................................................................................................................. 16
5.2 WI-FI POWER CONSUMPTION ............................................................................................................. 16
5.3 WI-FI SENSITIVITY SPECIFICATION ........................................................................................................ 17
5.4 WI-FI RF TX SPECIFICATION ............................................................................................................... 17
6. BT SPECIFICATION............................................................................................................................ 18
6.1 RF SPECIFICATION ............................................................................................................................. 18
6.2 BT POWER CONSUMPTION ................................................................................................................. 18
7. DIMENSIONS ................................................................................................................................... 19
7.1 PHYSICAL DIMENSIONS ....................................................................................................................... 19
7.2 TOP VIEW ........................................................................................................................................ 19
7.3 PCB FOOTPRINT (TOP VIEW) .............................................................................................................. 19
8. RECOMMENDED REFLOW PROFILE ................................................................................................. 20