Specifications

Rev. 1.0 January 2012
www.aosmd.com
Page 15 of 15
AOZ197
8
Package Dimensions, SOIC-20L
Notes:
1. All dimensions are in millimeters.
2. Dimensions are inclusive of plating.
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mil each.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
5. Refer to JEDEC MS-013 AC.
Symbols
A
A1
A2
b
c
D
E
E1
e
L
L1
L2

RECOMMENDED LAND PATTERN
Min.
2.35
0.10
2.05
0.35
0.23
12.60
7.40
10.00
0.50
0°
Nom.
2.52
0.20
2.35
—
—
12.70
7.50
1.27 BSC
1.35 REF
0.25 BSC
10.20
0.80
—
Max.
2.65
0.30
2.55
0.49
0.32
12.80
7.60
10.60
1.27
8°
Symbols
A
A1
A2
b
c
D
E
E1
e
L
L1
L2

Min.
0.093
0.004
0.081
0.014
0.009
0.496
0.291
0.394
0.020
0°
Nom.
0.099
0.008
0.093
—
—
0.500
0.295
0.050 BSC
0.053 REF
0.010 BSC
0.402
0.031
—
Max.
0.104
0.012
0.100
0.019
0.013
0.504
0.299
0.417
0.050
8°