Instruction manual

2. Preparation for Installation
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rack including the side walls, pillars, guide rails and front and rear doors.
Because the AX2230S-24T, AX1250S-24T2C, and AX1240S-24T2C are fanless
models, heat also dissipates from the top panels of these switches. To ensure
adequate heat dissipation, do not stack another device on top of or below the
Switch.
When mounting these Switches in a rack, keep a space of 1U or more between
them.
Do not block the ventilation slots. Otherwise, internal heat is not discharged, which
may cause damage. Maintain a space of at least 50 mm around the ventilation slots.
Make sure that the temperature inside the rack is within the operating temperature
specified for the switch. Otherwise, the device might malfunction or fail. To meet the
temperature requirements, consider the following means:
 Install fans inside the rack for sufficient ventilation.
 Replace the front and the rear doors with punched holes for cooling or remove
the doors in order to achieve good ventilation.
 Reduce the number of items contained in the rack and mount the device under
other heat emitting bodies when necessary.
When equipment with forced air cooling systems is installed above or below the
Switch, interference due to the airflow from nearby equipment can adversely affect
the cooling of the Switch, which might result in a malfunction. Keep spaces between
the systems in the rack to prevent air flow interference.
 The exhaust airflow from nearby equipment might be drawn into the Switch,
and the Switch air intake temperature might exceed the environment
requirements.
 When nearby equipment has too strong an intake or exhaust air system,
reverse air pressure might affect the Switch airflow, decreasing the
performance of internal cooling.