Specification

[AP1034]
016003455-E-01 - 22 - 2016/06
Recommended Land Pattern
AP1034AER 24-pin QFN Package
0.2
2.6
3.0
4.6
0.22±0.05
2.6
3.0
4.6
φ0.3
Thermal Via
unitmm
AP1034AEN 32-pin QFN Package
unit: mm
*The most suitable dimensions of the mount pad change by a substrate material, solder paste materials, a soldering
method, device precision. It is therefore recommended that customers contact the actual design should be optimized
according to the situation.