Installation Instructions

AI-NB25
NB-IoT Module
Sichuan AI-Link Technology Co.,Ltd. page 18 of 20
9. Soldering Reflow Recommendation
Heating zone: temperature: <150 C, time: 60~90 seconds, the slope is controlled at 1~3 C /S.
Preheating constant temperature zone: temperature: 150 ~ 200 c, time: 60-120 seconds,
the slope is between 0.3-0.8.
Reflow soldering area: the peak temperature is 235 C ~250 C (recommended peak
temperature is less than 245 C), and the time is 30-70 seconds.
Cooling zone: temperature: 217 C ~170 C, slope at 3~5 C /S
The solder is tin silver copper alloy lead-free solder / Sn&Ag&Cu Lead-free solder (SAC305).
Note: The product can withstand the limit temperature of 255 degrees and 5 seconds.
In order to ensure the product quality, the reflux curve should seek a balance between
PCB and components without damaging the quality of solder joints, and should be carried
out within the above curve range.