Specifications

3
安捷倫科技高頻元件量測研討會
2/23/2006
Page 5
Why SIP ?
Single Chip
Solution
SoC IC
Build-up
Substrate
Sub-System
Module
Board Assembly
Passives
Micro-
component
Memory IC
SIP
Compare to Board Assembly:
Compare to Board Assembly:
Performance Enhancement
Performance Enhancement
Thinner, Smaller, and Lighter
Thinner, Smaller, and Lighter
Low Cost
Low Cost
Compare to SOC
Compare to SOC
Low Cost
Low Cost
Time to Market
Time to Market
Flexible
Flexible
SIP
SIP
Platform
Platform
Die
Stacking
Platform
Package
Stacking
Platform
Flash SDRAM
ASIC
Flash SDRAM
ASIC
ASIC
Flash SDRAM
安捷倫科技高頻元件量測研討會
2/23/2006
Page 6
1.4mm
1.2mm
0.8mm
1.0mm
0.5mm
2 die 3 die 4 die 5 die 7 die
Die Stacking Package Trend
• Smaller & Lighter Package Size
• High Density Device in Package