Specifications

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安捷倫高頻元件量測研討會
2/23/2006
Page 1
Packaging Development
Trend of Integrated
Analysis
Sung-Mao Wu
安捷倫科技高頻元件量測研討會
2/23/2006
Page 2
Outline
Development Trend for PKG
-- PKG Technology Trend
-- Why SiP and POP/PIP
Challenges to PKG Integrity Design
-- Design Challenges on Simulation, Measurement and Design
-- Case I : Effective DK
-- Case II : Impedance Control verify by TDR
-- Case III: TDR FA Application
-- Case IV : Substrate Ball Pad Design
-- Case V : PDS Analysis
Integrated Design
-- Components of Optimization PKG Design
-- Advanced PKG Analysis Flow
-- Plan and Actions for PKG Design