Specifications

12
安捷倫科技高頻元件量測研討會
2/23/2006
Page 23
Design Rule/Spec
for substrate layout
Characterization Lab
capability on Electrical,
Thermal, Stress
and Material
Components of Optimization Package Design
Pkg options:
structure,
cost,
thermal,
board level...
Substrate:
laminate,
build-up,
ceramic,
RLC embed
Wire &
Bumping
Leadframe:
L/F for SOP/QFP etc,
L/F for BCC/QFN etc.
•Knowing Electrical
Characteristics
deep inside
•Provide package solutions
from advanced pkg
technology
安捷倫科技高頻元件量測研討會
2/23/2006
Page 24
Integrity Design Flow for Advanced PKG
Quasi-State EM
Simulator
•Whole PKG modeling
extracting
High Frequency/Speed
Simulator
•3D Field solver
•FTDT simulator
•2.5D Momentum
•PDS Simulator
Frequency Domain
•VNA/PNA with PLTS/ADS
8722ES (40GHz, 2-port)
8364B (50GHz, 4-port)
•Impedance Analyzer
•Spectrum analyzer
Measurement Plane
•Probe Station
Single-side 2-port
Double-Side Multi-port
•High Performance Probe (50GHz)
•High Performance cable (50GHZ)
Time Domain
•Time Domain Reflectometer
with TDA/
•High Speed Pattern Generator
POST-Analysis Capability
& Integrated plane
•Broadband modeling
•Signal Integrity (SI)
•PDS analysis
•EMI/EMC analysis
•data flow control plane
•PKG IP Development
System Integrity Analysis
and Design Guide for
Advance Package
Software
Hardware
Substrate Design / Pre-simulation
•Design Guideline and Constraint
Simulation
Transfer interface
Design Constraint & PKG IP