Specifications

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安捷倫科技高頻元件量測研討會
Feb.23, 2006
Page 65
Using ADS for Signal
Integrity Design
Example Measurements
Page 66
安捷倫科技高頻元件量測研討會
Feb.23, 2006
Common SI Problem
Objective: 1m of “improved FR-4” through multiple high speed connectors.
10” (254mm) Line Card > 20” (508mm) Backplane > 10” (254mm) Line Card.
Check Eye Diagram at various points along the path.
Board Traces 2” (51mm) – 10” (254mm)
Backplane Traces
2-3 chassis/rack = 10” (254mm) worst case
5-8 chassis/rack = 40” (1016mm) worst case
Card
Card
Package
Die
Package
Die
Driver
Receiver
Card
High speed Connectors
IBIS or Encrypted
Hspice model
IBIS or Encrypted
Hspice model