Specifications

11
安捷倫科技高頻元件量測研討會
2/23/2006
Page 21
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Frequency (GHz)
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
S
2
1
(
d
B
)
Bare PCB
package only
BGA and PCB
Effect of package
Noise coupling between PKG&PCb?
Analysis Case V :
Æ
comparison with bare PCB, Package and BGA+PCB
安捷倫科技高頻元件量測研討會
2/23/2006
Page 22
Outline
Development Trend for PKG
-- PKG Technology Trend
-- Why SiP and POP/PIP
Challenges to PKG Integrity Design
-- Design Challenges on Simulation, Measurement and Design
-- Case I : Effective DK
-- Case II : Impedance Control verify by TDR
-- Case III: TDR FA Application
-- Case IV : Substrate Ball Pad Design
-- Case V : PDS Analysis
Integrated Design
-- Components of Optimization PKG Design
-- Advanced PKG Analysis Flow
-- Plan and Actions for PKG Design