Technical data

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Contents-l
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Determining the HP-MSIB Address
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Addressing the Module
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Preparation for Use
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2. Installation
Introduction
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Instrument Shipping Preparation Procedure.
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Packaging
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Returning Instruments for Service
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Static-Safe Accessories
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Sales and Service Offices
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Handling of Electronic Components
Test Equipment
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Reducing ESD Damage
.
Electrostatic Discharge Information
:
Mainframe/Module Interconnect
: : : : VIDEO ’
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VIDEO OUT
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VIDEO IN
LINEARAGC
21.4MHz OUT
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21.4MHz IN
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Rear-Panel Inputs and Outputs
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Module Latch
21.4-M&
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IF
0-1V
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VIDEO
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Front-Panel Outputs
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ERR (Error) LED
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ACT (Active) LED
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Front-Panel Status Indicators
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Front/Rear-Panel Features
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Accessories
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Initial Inspection
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Manual Updating Supplement
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Modules Covered by Manual
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Serial Numbers
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Structural Terms
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Safety Considerations
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Functional Terms
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Modular Measurement System Terms
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Module Description
General Information
Introduction
Contents
1.