Service manual

Chapter 4 103
Assembly Replacement and Post-Repair Procedures
Replacement of Onstage Buffer Unit and Connection Board
1. Chapter Title
2. Chapter Title 3. Chapter Title
4. Assembly Replacement
5. Chapter Title
and Post-Repair Procedures
contact to the electrode pattern on the head amplifier. If contact is bad, make a fine
adjustment on the positioning of the head amplifier after attachment.
Step 3. Fasten screws and fix the head amplifier to the HLM tightly.
Inspecting the Pads Condition
The life time is approximately 100,000 contacts. However, improper operation might
damage the wire on the pad. This causes the short circuit between the terminals on the
connection board.
Four sets of this are furnished with the system as spares. When you need them more, order
PN E5029-65001. It consists of 20 long pads and 10 short pads.
Performance Verification
Follow steps below and check that the head amplifier is properly attached.
Step 1. Start the system up and prepare for head measurement.
Step 2. Attach a head, that is know to be working properly, to a casette and measure DCR. If the
result of the measurement is correct, the head amplifier is properly attached. If the result is
clearly wrong (for example the result is clearly big or 0), the head amplifier is not properly
attached. That means, pogo pins on the casette and electrode on the amplifier has bad
contact. In this case, return to the section “Attachment of Head Amplifier” and check
contact.