Service manual

Repair/
Maintenance
Guidelines
This section provides guidelines for repairing and maintaining the
Agilent E1465A/E1466A/E1467A matrix modules, including:
• ESD precautions
• Soldering printed circuit boards
• Post-repair safety checks
ESD
Precautions
Electrostatic discharge (ESD) may damage static-sensitive devices in the
matrix modules. This damage can range from slight parameter degradation
to catastrophic failure. When handling the matrix module assemblies, follow
these guidelines to avoid damaging components:
• Always use a static-free work station with a pad of conductive rubber or
similar material when handling electronic components.
• Do not use pliers to remove a MOS or CMOS device from a high-grip
socket. Instead, use a small screwdriver to pry the device up from one
end. Slowly lift the device up, one pair of pins at a time.
• After you remove a MOS or CMOS device from a module, place the
device onto a pad of conductive foam or other suitable holding material.
• If a device requires soldering, be sure the assembly is placed on a pad of
conductive material. Also, be sure that you, the pad, and the soldering
iron tip are grounded to the assembly.
Soldering Printed
Circuit Boards
The etched circuit boards in the matrix modules have plated-through holes
that allow a solder path to both sides of the insulating material. Soldering
can be done from either side of the board with equally good results. When
soldering to any circuit board, keep in mind the following guidelines:
• Do not use a high power soldering iron on etched circuit boards, as
excessive heat may lift a conductor or damage the board.
• Use a suction device or wooden toothpick to remove solder from
component mounting holes. When using a suction device, be sure that the
equipment is properly grounded.
Agilent E1465A/66A/67A Service Manual Service 69