Service manual

components.
• After you remove an assembly from the multimeter, place the
assembly on a conductive surface to guard against ESD damage.
Do not stack assemblies.
• Do not use pliers to remove a MOS or CMOS device from a
high-grip socket. Instead, use a small screwdriver to pry the
device up from one end. Slowly lift the device up, one pair of
pins at a time.
• After you remove a MOS or CMOS device from an assembly,
place the device onto a pad of conductive foam or other suitable
holding material.
• If a device requires soldering, be sure the assembly is placed on a
pad of conductive material. Also, be sure you, the pad, and the
soldering iron tip are grounded to the assembly. Apply as little
heat as possible when soldering.
• When you replace a MOS or CMOS device, ground the foam to
the multimeter before removing the device from the foam.
Figure 8-2. Removing Binding Posts
Service 8-7