User`s manual

Appendix A
Agilent E1490C Breadboard Specifications
Agilent E1490C Breadboard module specifications follow.
Item Specification
User Component Area 490 cm
2
(76 inches
2
)
Grid Hole Spacing 2.54 mm (0.1 inch)
Grid Hole Inside Diameter 1.17 mm (0.046 inch)
Maximum Component Height 18.0 mm (0.71 inch) above PC board
Maximum Lead Length 3.2 mm (0.125 inch) below PC board
Maximum Power Dissipation
(per module)
Determined by mainframe cooling. Cannot
exceed the number of watts per slot total cooling
capacity available. (Backplane interface circuitry
consumes 1.75 watts).
Power Supplies + 5 VDC @ 350 milliampheres is required for full
backplane interface circuitry. Other backplane
voltages available as stubs on the module are:
+ 5, + 5 VSTDBY, – 5.2 V, +12 V – 12 V,
+ 24 V, – 24 V, and – 2 V.
Terminal Module Connector Maximum current 1.0 Amp. Derate to 100 mA
when using PC board traces.
Appendix A Agilent E1490C Breadboard Specifications 63