User`s manual

Reducing Risk of
Static Discharge
Damage
The smallest static voltage most people can feel is about 3500 V. It takes
less than one-tenth of that (about 300 V) to destroy or severely damage
static-sensitive circuits. Often, static damage does not immediately cause a
malfunction, but significantly reduces the component’s life. Adhering to the
following precautions will reduce the risk of static discharge damage.
• Keep the module in its conductive plastic bag when not installed in a
VXIbus mainframe. Save the bag for future module storage.
• Before handling the module, select a work area where potential static
sources are minimized. Avoid working in carpeted areas and
non-conductive chairs. Keep body movement to a minimum.
If possible, use a controlled-static workstation.
• Handle the module only by the metal cover plate. Avoid touching
any components or edge connectors. When you are ready to
configure the module, remove it from its protective bag and lay it on
top of the bag while keeping your free hand in contact with the bag.
This technique maintains your body and the module at the same
static potential.
• Keep one hand in contact with the protective bag as you pick up the
module with your other hand. Then, before installing the module,
move your free hand to a metal surface on the mainframe, thus
bringing you, the module, and the mainframe to the same static
potential.
• Do not install a module without its metal shields attached. (While
the module is installed, it is protected from static discharge damage.)
Hardware Description
Figure 2-1 shows the Agilent E1490C with the metal shields removed. As
shown, the breadboard module consists of a printed circuit board with two
backplane connectors (P1 and P2), a front panel DIN connector (J2), and a
terminal module.
Common traces are provided at the upper and lower edges of the printed
circuit board to form power supply or ground buses. Do not mount
components where they will cross these buses.
14 Configuring the Agilent E1490C Chapter 2