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Test Header Jumper Positions
The Electronic Load mainframe contains a primary test header (TP201) located on the GPIB Board, and each module
contains a secondary test header (TP301) located on the Control Board. The test headers have jumper positions for signature
analysis and other functions as described below.
Primary Test
Header TP201
Pins
Description
1 and 2 + 5V (primary).
3 and 4 With jumper RTP201 installed between these pins, the primary microprocessor is
placed in the SA mode. Removing RTP201 takes the microprocessor out of the SA
mode.
5 and 6 With jumper RTP201 installed between these pins, the primary microprocessor will
ignore calibration commands, providing security against unauthorized calibration. With
RTP201 removed, the microprocessor will respond to calibration commands.
7 and 8* SA gate test points (normal operating/storage position for RTP201).
9 thru 16 Test points for the chip select signals CSP0 through CSP7.
*As shipped from the factory, jumper RTP201 is installed between TP201 pins 7 and 8. Both of these pins are connected to
the primary SA gate signal, which is used as the start/stop signal when taking signatures during primary SA testing. See
"Test Setup for Signature Analysis''
Secondary
Test Header
TP301 Pins
Description
1 and 2 With jumper RTP301 installed between these pins, the secondary microprocessor is
placed in the SA mode. Removing RTP301 takes the microprocessor out of the SA
mode.
3 and 4* SA gate test points (normal operating/storage position for RTP301).
5 and 7 With RTP301 installed between these pins, the secondary microprocessor will skip
selftest at power-on. With RTP301 removed, the selftest will be performed.
6 Connected to secondary common.
8 + 5V (secondary).
* As shipped from the factory, jumper RTP301 is installed between pins 3 and 4 . Both of these pins are connected to the
secondary SA gate signal, which is used as the start/stop signal when taking signatures during secondary SA testing. See
"Test Setup for Signature Analysis".
Test Setup for Signature Analysis
Chapter 2 contains instructions for disassembling the mainframe and modules to allow access for troubleshooting and repair.
Figure 3-2 illustrates the primary (TP201) and secondary (TP301) test header connections required to perform the signature
analysis tests given in Tables 3-4 through 3-14.