Specifications

10
© 2012 Emerson Climate Technologies, Inc.
Printed in the U.S.A.
AE8-1368 R2
The E2 should look like Figure 4.1.
4.1 Dip Switch Confi guration
CoreSense Diagnostics v2.11 devices are equipped
with a DIP switch to set their node address. In addition,
this DIP switch determines the baud rate, parity, control
mode, and failsafe settings of the module. Refer to
Figure 4.2 below for details:
To ensure proper communications, follow these steps:
1. Each CoreSense Diagnostics device that is
connected to a rack controller should have a
unique node address (as determined by the DIP
switch settings).
2. The communications jumper should be set for
E2 communication if connected to an E2 rack
controller.
3. The last CoreSense Diagnostics device in the
daisy-chain should have the communication
jumper in the “terminated” position. In addition,
the E2 should have the communication jumpers
in the “terminated” position.
4. The parity for each of the CoreSense Diagnostics
devices should be set to none. This can be
accomplished by setting DIP switch number 8 to
the down position.
5. The baud rate for each of the CoreSense
Diagnostics devices should be set according to
the rack controller. To determine the baud rate in
the E2, follow these steps:
a. From the main menu select 7 (System
Confi guration)
b. Press 3 (System Information)
c. Press 1 (General Controller Info)
d. Access the Serial Communications Tab by
pressing CTRL + 3
e. Use the Page Down button or scroll down to
view the MODBUS communication settings.
Note: The default location for CoreSense
diagnostic modules is the COM4 port, but
there may be multiple MODBUS networks
running on one E2. Be sure to select the
proper network.
The E2 should look like Figure 4.3 (following page).
Be sure that the DIP switch settings on each module
for the CoreSense Diagnostics devices match the
settings for the MODBUS network.
4.2 Network Setup
Once the DIP switch settings have been verifi ed for
each CoreSense Diagnostics module, you will need to
establish communications with the new devices. Begin
Figure 4.1 - Firmware Revision
Figure 4.2 - Control Module Instruction Label