User`s manual

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Figure 3.2:Standard CMOS features screen ................. 41
3.4 Advanced BIOS Features................................................ 42
Figure 3.3:Advanced BIOS features screen.................. 42
3.4.1 Hard Disk Boot Priority................................................ 42
3.4.2 Virus Warning............................................................... 42
3.4.3 CPU L1 & L2 Cache..................................................... 42
3.4.4 Hyper-Threading Technology....................................... 42
3.4.5 Quick Power On Self Test ............................................ 43
3.4.6 First/Second/Third Boot Device .................................. 43
3.4.7 Boot Other Device ........................................................ 43
3.4.8 Swap Floppy Drive ...................................................... 43
3.4.9 Boot UP Floppy Seek ................................................... 43
3.4.10 Boot Up NumLock Status............................................. 43
3.4.11 Gate A20 Option........................................................... 43
3.4.12 Typematic Rate Setting................................................. 43
3.4.13 Typematic Rate (Chars/Sec) ......................................... 43
3.4.14 Typematic Delay (msec)............................................... 43
3.4.15 Security Option ............................................................. 44
3.4.16 APIC Mode ................................................................... 44
3.4.17 MPS Version Control For OS....................................... 44
3.4.18 OS Select For DRAM > 64MB .................................... 44
3.5 Advanced Chipset Features............................................. 44
Figure 3.4:Advanced chipset features screen ............... 45
3.5.1 DRAM Timing Selectable ............................................ 45
3.5.2 CAS Latency Time ....................................................... 45
3.5.3 Active to Precharge Delay ............................................ 45
3.5.4 DRAM RAS# to CAS# Delay ..................................... 45
3.5.5 DRAM RAS# Precharge............................................... 45
3.5.6 Memory Frequency....................................................... 45
3.5.7 System BIOS Cacheable............................................... 46
3.5.8 Video Bios Cacheable................................................... 46
3.5.9 Memory Hole At 15M-16M ......................................... 46
3.5.10 Delay Prior to Thermal ................................................. 46
3.5.11 AGP Aperture Size (MB) ............................................. 46
3.5.12 On-Chip Frame Buffer Size .......................................... 46
3.6 Integrated Peripherals...................................................... 47
Figure 3.5:Integrated peripherals.................................. 47
Figure 3.6:On-Chip IDE Device................................... 47
3.6.1 IDE HDD Block Mode ................................................. 48
3.6.2 On-Chip IDE Device .................................................... 48
3.6.3 On-Chip Serial ATA..................................................... 48
3.6.4 Serial ATA Port0/Port1 Mode ...................................... 48
Figure 3.7:Onboard Device........................................... 48
3.6.5 USB Controller ............................................................. 49
3.6.6 USB 2.0 Controller ....................................................... 49