Specifications

9/11
ONEWAVE TECHNOLOGY CO., LTD.
5.Soldering and Mounting
Mildly activated rosin fluxes are preferred. The minimum amount of solder can
lead to damage from the stresses caused by the difference in coefficients of
expansion between solder, chip and substrate. The terminations are suitable
for all wave and re-flow soldering systems. If hand soldering cannot be
avoided, the preferred technique is the utilization of hot air soldering tools.
Recommended temperature profiles for re-flow soldering in Figure 1.
Products attachment with a soldering iron is discouraged due to the inherent
process control limitations. In the event that a soldering iron must be
employed the following precautions are recommended.
‧Preheat circuit and products to 150℃
‧Never contact the ceramic with the iron tip
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧280℃ tip temperature (max)
‧1.0mm tip diameter (max)
‧Limit soldering time to 3 sec.
SOLDERING
COOLING
NATURAL
PRE-HEATING
TEMPERATURE(°C)
60~120 s
10s max.
30~60s
250~260
230
180
150
TIME(sec.)
Reflow Soldering
SOLDERING
COOLING
NATURAL
PRE-HEATING
TEMPERATURE(°C)
within 3s
Gradual cooling
150
TIME(sec.)
Iron Soldering
Over 60s
350
300