Specifications

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ONEWAVE TECHNOLOGY CO., LTD.
4.Reliability and Test Condictions
ITEM
REQUIREMENTS
TEST CONDITION
Solderability
1. Wetting shall exceed 90% coverage
2. No visible mechanical damage
Pre-heating temperature:150℃/60sec.
Solder temperature:230±5℃
Duration:4±1sec.
Solder:Sn-Ag3.0-Cu0.5
Flux for lead free: rosin
Solder heat
Resistance
1. No visible mechanical damage
2. Central Freq. change :within ± 6%
10±0.5 sec.
60sec
..
TEMP (℃)
150℃
260℃
Pre-heating temperature:150℃/60sec.
Solder temperature:260±5℃
Duration:10±0.5sec.
Solder:Sn-Ag3.0-Cu0.5
Flux for lead free: rosin
Component
Adhesion
(Push test)
1. No visible mechanical damage
The device should be reflow soldered(230±5℃
for 10sec.) to a tinned copper substrate A
dynometer force gauge should be applied the
side of the component. The device must
with-ST-F 0.5 Kg without failure of the
termination attached to component.
Component
Adhesion
(Pull test)
1. No visible mechanical damage
Insert 10cm wire into the remaining open eye
bend ,the ends of even wire lengths upward
and wind together.
Terminal shall not be remarkably damaged.
Thermal shock
1. No visible mechanical damage
2. Central Freq. change :within ±6%
Phase
Temperature(℃)
Time(min)
1
+110±5℃
30±3
2
Room
Temperature
Within
3sec
3
-40±2℃
30±3
4
Room
Temperature
Within
3sec
+110℃=>30±3min
-40℃=>30±3min
Test cycle:10 cycles
The chip shall be stabilized at normal condition
for 2~3 hours before measuring.
Resistance to
High
Temperature
1. No visible mechanical damage
2. Central Freq. change :within ±6%
3. No disconnection or short circuit.
Temperature: +110±5℃
Duration: 1000±12hrs
The chip shall be stabilized at normal condition
for 2~3 hours before measuring.
Resistance to
Low
Temperature
1. No visible mechanical damage
2. Central Freq. change :within ±6%
3. No disconnection or short circuit.
Temperature:-40±5℃
Duration: 1000±12hrs
The chip shall be stabilized at normal condition
for 2~3 hours before measuring.
Humidity
1. No visible mechanical damage
2. Central Freq. change :within ±6%
3. No disconnection or short circuit.
Temperature: 40±2℃
Humidity: 90% to 95% RH
Duration: 1000±12hrs
The chip shall be stabilized at normal condition
for 2~3 hours before measuring.
4±1 sec.
60sec
TEMP (℃)
150℃
230℃