User`s guide

16 • Introduction
Environment
• Operating temperature: 0 ~ 50 °C (Note 1)
• Storage temperature: -20 ~ 80 °C
• Humidity: 5% ~ 95% non-condensed
• Shock: 15G peak-to-peak, 11 ms duration, 3 axes, 3 times / axis
non-operation
• Vibration: (Note 3)
9 None-operation: 1.88G rms, 5~500Hz, 3 axes, with package
9 Operation: 0.5G rms, 5~500Hz, each axis with flash disk drive
Note:
1. Certified with ADLINK thermal design. The thermal performance is
dependent on the cooling design
2. Forced air-cooling with 50 CFM is required for both single 2.4G Xeon or
dual low-voltage 1.6G Xeon configurations.
3. Temperature limit of optional mass storage devices can impact the
thermal specification of the board.
4. Operational vibration is limited by the 2.5 inches HDD. When application
requires higher definition for anti-vibration, we recommend using
Flash2000 Flash Disk (FFD series) or CompactFlash to avoid using a
hard disk drive.
Safety Certificate and Test
• CE; FCC Class B
• HALT (temperature and vibration stress) verified
• All plastic material, PCB and Battery used are all UL-94V0 certified
• Designed for NEBS 3.0 requirement
• MTBF: >100,000 hours