Specifications
SATA-IO Confidential 6
2.5.10. IPM-10 : Slumber State exit latency (device-initiated) .......................................................................... 35
2.5.11. IPM-11 : Speed matching upon resume (device-initiated) .................................................................... 36
2.6. Mechanical - Cable Assembly - Standard Internal and eSATA ....................................................................... 37
2.6.1. MCI-01 : Visual and Dimensional Inspections .......................................................................................... 37
2.6.2. MCI-02 : Insertion Force (Latching and Non-Latching) ............................................................................ 38
2.6.3. MCI-03 : Removal Force (Non-Latching) .................................................................................................. 38
2.6.4. MCI-04 : Removal Force (Latching) .......................................................................................................... 38
2.6.5. MCX-05 : Cable Pull-out - internal (normative) and eSATA (informative) cables ..................................... 38
2.6.6. MCE-01 : Visual and Dimension Inspection for eSATA cables (informative) ........................................... 39
Pass/Fail Criteria ..................................................................................................................................................... 39
2.7. Electrical - Cable Assembly – Standard Internal and eSATA .......................................................................... 39
2.7.1. SI-01 : Mated Connector Impedance ........................................................................................................ 40
2.7.2. SI-02 : Cable Absolute Impedance ........................................................................................................... 40
2.7.3. SI-03 : Cable Pair Matching ...................................................................................................................... 41
2.7.4. SI-04 : Common Mode Impedance ........................................................................................................... 41
2.7.5. SI-05 : Differential Rise Time .................................................................................................................... 42
2.7.6. SI-06 : Intra-Pair Skew .............................................................................................................................. 43
2.7.7. SI-07 : Insertion Loss ................................................................................................................................ 43
2.7.8. SI-08 : Differential to Differential Crosstalk: NEXT ................................................................................... 43
2.7.9. SI-09 : Inter-Symbol Interference .............................................................................................................. 44
2.8. Mechanical – Device - Standard Internal Connector ....................................................................................... 44
2.8.1. MDI-01 : Connector Location .................................................................................................................... 44
2.8.2. MDI-02 : Visual and Dimensional Inspections .......................................................................................... 46
2.9. Mechanical – Device - Power Connector ......................................................................................................... 47
2.9.1. MDP-01 : Visual and Dimensional Inspections ......................................................................................... 47
2.10. Mechanical – Host - Standard Internal Connector ....................................................................................... 47
2.10.1. MHI-01 : Visual and Dimensional Inspections (Informative) ................................................................. 47
2.11. Mechanical – Drive/Host – eSATA Connector (informative) ........................................................................ 48
2.11.1. MXE-01 : Visual and Dimension Inspection .......................................................................................... 48
2.12. Phy General Requirements .......................................................................................................................... 49
2.12.1. PHY-01 : Unit Interval ............................................................................................................................ 49
2.12.2. PHY-02 : Frequency Long Term Stability .............................................................................................. 49
2.12.3. PHY-03 : Spread-Spectrum Modulation Frequency .............................................................................. 49
2.12.4. PHY-04 : Spread-Spectrum Modulation Deviation ................................................................................ 50
2.13. Phy Transmitter Requirements ..................................................................................................................... 50
2.13.1. TX-01 : Pair Differential Impedance ...................................................................................................... 50
2.13.2. TX-02 : Single-Ended Impedance (Obsolete) ....................................................................................... 50
2.13.3. TX-03 : Gen2 (3Gb/s) Differential Mode Return Loss ........................................................................... 51
2.13.4. TX-04 : Gen2 (3Gb/s) Common Mode Return Loss ............................................................................. 51
2.13.5. TX-05 : Gen2 (3Gb/s) Impedance Balance ........................................................................................... 52
2.13.6. TX-06 : Gen1 (1.5Gb/s) Differential Mode Return Loss ........................................................................ 52
2.14. Phy Transmit Signal Requirements .............................................................................................................. 53
2.14.1. TSG-01 : Differential Output Voltage .................................................................................................... 53
2.14.2. TSG-02 : Rise/Fall Time ........................................................................................................................ 54
2.14.3. TSG-03 : Differential Skew .................................................................................................................... 55
2.14.4. TSG-04 : AC Common Mode Voltage ................................................................................................... 55
2.14.5. TSG-05 : Rise/Fall Imbalance ............................................................................................................... 55
2.14.6. TSG-06 : Amplitude Imbalance ............................................................................................................. 56
2.14.7. TSG-07 : Gen1 (1.5Gb/s) TJ at Connector, Clock to Data, f
BAUD
/10 (Obsolete) ................................... 56
2.14.8. TSG-08 : Gen1 (1.5Gb/s) DJ at Connector, Clock to Data, f
BAUD
/10 (Obsolete) .................................. 57
2.14.9. TSG-09 : Gen1 (1.5Gb/s) TJ at Connector, Clock to Data, f
BAUD
/500 ................................................... 57
2.14.10. TSG-10 : Gen1 (1.5Gb/s) DJ at Connector, Clock to Data, f
BAUD
/500 .................................................. 58
2.14.11. TSG-11 : Gen2 (3Gb/s) TJ at Connector, Clock to Data, f
BAUD
/500 ...................................................... 58
2.14.12. TSG-12 : Gen2 (3Gb/s) DJ at Connector, Clock to Data, f
BAUD
/500 ..................................................... 59
2.15. Phy Receiver Requirements ......................................................................................................................... 59
2.15.1. RX-01 : Pair Differential Impedance ...................................................................................................... 59