Specifications

ST72325xx
180/197
13.3 SOLDERING INFORMATION
■ In order to meet environmental requirements,
ST offers these devices in ECOPACK®
packages. These packages have a lead-free
second level interconnect. The category of
second level interconnect is marked on the
package and on the inner box label, in
compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions
are also marked on the inner box label.
■ ECOPACK is an ST trademark. ECOPACK®
specifications are available at www.st.com.