User Manual

ADCP-75-192 • Issue D • October 2005 • Section 2: Description
Page 2-4
 2005, ADC Telecommunications, Inc.
Connection of power is described per wiring diagram. Air baffles are inserted into unused
slots. Modules are extracted by pushing outward on the extractor release buttons and drawing
the module out of chassis. They are inserted by aligning the module into desired slot and
pressing inward on the extractor button until the module is securely seated. Refer to Table 2-3
for slot assignments. Slots 1 – 4 are for tenant sector 1/3 and slots 5 – 8 are for tenant sector
2/4.
Table 2-3. RF Chassis Slot Assignments
SLOT MODULE
8 FBHDC
7 FSC
6
5 HUC
4 FBHDC
3 FSC
2
1 HUC
1.3 Radio Access Node (RAN)
The RAN cabinet, shown in Figure 2-3, is a NEMA-3R enclosure (with removable dust filter)
that provides the following basic functions:
• Houses the various electronic modules including
− RAN Chassis and Backplane
− Central Processing Unit (CPU)
− System Interface (STF)
− Sonet Interface (SIF)
− RAN Down Converter (RDC)
− RAN Up Converter (RUC)
− AC Power Entry Card (APEC)
− DC Power Entry Card (DPEC)
− RF Assembly (RFA) consisting of Power Amplifiers, duplexers, and RF Assembly
Interface Controller (RIC).
• Houses accessory items such as back-up battery and WDM modules
• Protects all modules from the weather.
• Provides electrical interface connections for the RAN Chassis and RFA modules.
• Provides ventilation openings to allow the entry of cool air and the escape of heated
air.