Datasheet

Revised Date:
April 16, 2007
ds_pl2303HXD_v1.1.doc
4.2 QFN32 Package
RTS_N
NC
GND
GND TEST
RESERVED
NC NC TXD DTR_N
VDD_325
RXD
RI_N
GND
VDD_33
DSR_N
DCD_N
CTS_N
SHTD_N
GP3
GP2
NC
NC DP
DM
NC
GP1
GP0
NC
VDD_5
RESET_N
VO_33
PL-2303HXD
1
Exposed Die Pad connects to VO_33
Figure 4-2 Pin Assignment Outline of PL-2303HX (Rev D) QFN32
Warning: The exposed center die pad of the PL-2303HX QFN package is connected (bonded) to the
pin VO_33 so it is very important to design the PCB layout wherein this exposed die pad
won’t get grounded on the PCB when mounted.
PL-2303HX (Rev D) Product Datasheet - 12 - Document Version 1.1