Datasheet

NTAG203 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PROPRIETARY
Rev. 3.0 — 17 October 2011
213830 4 of 30
NXP Semiconductors
NTAG203
NFC Forum Type 2 Tag compliant IC with 144 bytes user memory
6. Wafer layout
(1) Y-Scribeline width: 15 m
(2) X-Scribeline width: 15 m
(3) Chip step, x-length: 688 m
(4) Chip step, y-length: 688 m
(5) LA bump edge to chip edge, y-length: 14.9 m
(6) LA bump edge to chip edge, x-length: 15 m
(7) LB bump edge to chip edge, y-length: 21.296 m
(8) LB bump edge to chip edge, x-length: 15 m
Remark: Lower left corner of metal sealring (X, Y) = 0,0
Remark: The scribeline width is not constant for laser diced wafers.
Fig 3. Chip orientation and bond pad locations
Table 3. Bonding pad assignments to smart card contactless module
Contactless interface module NTAG203
Antenna contacts Symbol Description
LA LA Antenna coil connection LA
LB LB Antenna coil connection LB
001aaj821
TEST
Y
X
VSSTEST
LB
LA
(2)
(3)
(4)
(1)
(5)
(7)
(8)
(6)
PAD
(center)
X
[μm]
Y
[μm]
VSS, TEST DISCONNECTED
LA 45.5 628
LB 628 51.1