Datasheet

YZT PACKAGE
(TOP VIEW)
D
C
B
A
3
2
1
TXB0104
SCES650F –APRIL 2006–REVISED MAY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TERMINAL ASSIGNMENTS
(YZT Package)
3 2 1
D A4 GND B4
C A3 OE B3
B A2 V
CCA
B2
A A1 V
CCB
B1
DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V
CCB
. V
CCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. V
CCA
should not exceed V
CCB
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
The TXB0104 is designed so that the OE input circuit is supplied by V
CCA
.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ — WCSP (DSBGA)
0.23-mm Large Bump – YZT Reel of 3000 TXB0104YZTR _ _ _ 2 K _
(Pb-free) 0.625-mm max height
UFBGA – GXU Reel of 2500 TXB0104GXUR YE04
UFBGA – ZXU (Pb-Free) Reel of 2500 TXB0104ZXUR YE04
TXB0104RGYR
QFN – RGY Reel of 1000 YE04
TXB0104RGYRG4
–40°C to 85°C
uQFN – RUT Reel of 3000 TXB0104RUTR 2KR
TXB0104D
Tube of 50
TXB0104DG4
SOIC – D TXB0104
TXB0104DR
Reel of 2500
TXB0104DRG4
TXB0104PWR
TSSOP – PW Reel of 2000 YE04
TXB0104PWRG4
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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Product Folder Links: TXB0104