Datasheet

DEVICE INFORMATION
Thermal Pad
(BottomSide)
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT23 OUT22 OUT21 OUT20 OUT19 OUT18 OUT17 OUT16
1 2 3 4 5 6 7 8
24 23 22 21 20 19 18 17
SIN
32
OUT8
SCLK
OUT9
BLANK
OUT10
GND
OUT11
VCC
OUT12
IREF
OUT13
XLAT
OUT14
SOUT
OUT15
9
10
31
11
30
12
29
1328
1427
1526
1625
GND
BLANK
SCLK
SIN
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
OUT8
OUT9
15
16
OUT10
OUT11
VCC
IREF
XLAT
SOUT
OUT23
OUT22
OUT21
OUT20
OUT19
OUT18
OUT17
OUT16
OUT15
OUT14
28
27
26
25
24
23
22
21
20
19
18
17
OUT13
OUT12
32
31
30
29
ThermalPad
(BottomSide)
TLC5947
SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com
HTSSOP-32
5-mm × 5-mm QFN-32
(1)
DAP PACKAGE
RHB PACKAGE
(TOP VIEW)
(TOP VIEW)
(1) This device is product preview.
NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB
pattern.
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Product Folder Link(s): TLC5947