User's Manual

S76S
LoRa Wireless Communication Module
H
901-10201
Mar 22th ,2017
15 of 18
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6. SiP Module Preparation
6-1. Handling
Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is
aligned and tested, it should be transport and storage with anti -static tray and packing. This protective
package must be remained in suitable environment until the module is assembled and soldered onto the
main board.
6-2. SMT Preparation
1. Calculated shelf life in sealed bag: 6 months at<40℃ and <90% relative humidity (RH).
2. Peak package body temperature: 250℃.
3. After bag was opened, devices that will be subjected to reflow solder or other high temperature
process must.
A. Mounted within: 168 hours of factory conditions<30℃/60%RH.
B. Stored at≦10%RH with N2 flow box.
4. Devices require baking, before mounting, if:
A. Package bag does not keep in vacuumed while first time open.
B. Humidity Indicator Card is >10% when read at 23±5℃.
C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours.
5. If baking is required, devices may be baked for 12 hours at 125±5℃.