User's Manual

AI7681H
MT7681
802.11b/g/n IOT Module
D
901-06201
May 19
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, 2015
12 of 17
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5. Module Preparation
5-1. Handling
Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and
tested, it should be transport and storage with anti -static tray and packing. This protective package must be
remained in suitable environment until the module is assembled and soldered onto the main board.
Base on reliability test result pass MRT L3 criteria, AI7681H refer to MSL3 criterion.
5-2. SMT Preparation
1. Calculated shelf life in sealed bag: 6 months at <40 degree and <90% relative humidity (RH).
2. Peak package body temperature: 250 degree.
3. After bag was opened, devices that will be subjected to reflow solder or other high temperature process
must.
A. Mounted within: 168 hours of factory conditions <30 degree / 60% RH.
B. Stored at
≦
10% RH with N2 flow box.
4. Devices require baking, before mounting, if:
A. Package bag does not keep in vacuumed while first time open.
B. Humidity Indicator Card is >10% when read at 23 ± 5 degree.
C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours.
5. If baking is required, devices may be baked for 12 hours at 125 ± 5 degree.
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