al nti fid e Product Name Ac Si PC on Version Doc No Date AI7681H MT7681 802.
Document History Date Revised Contents Revised By Version Initial Version Kidd A Feb 6th ,2015 Change Document Format & Specification Kidd B Apr 17th ,2015 Change Mechanical Dimensions & Product Kidd C Marking Kidd nti Change Product Marking for FCC & CE Ac Si PC on fid e May 19th ,2015 al Dec 9th ,2014 Product Name Version Doc No Date Page AI7681H MT7681 802.
INDEX 1. Description .................................................................................................................................................3 1-1. Block Diagram ...........................................................................................................................................4 1-2. Specification ..............................................................................................................................................4 2.
1. Description AcSiP Technology Corp. introduces a low-cost and low-power consumption IOT module, AI7681H. The AI7681H integrate Wi-Fi single chip, which supports IEEE 802.11b/g/n stream, providing GPIO for intelligent control, and UART interfaces for device communication. nti power manage unit for single 3.3V power source for cost effective design. al The AI7681H integrate chip antenna and 8Mbits flash to reduce customer platform size. And also integrate The AI7681H embedded 32-bit RISC MCU for 802.
1-1. Block Diagram fid e nti al A simplified block diagram of the AI7681H IOT module is depicted in the figure below. 1-2. Specification AI7681H PC on Model Name Product Description Network Standard Host Interface IOT Module Station mode：IEEE 802.11b/g/n AP mode：IEEE 802.11b/g UART / GPIO[0..4] Operation Conditions Storage：-40℃ ~ +85℃ Operating：-10℃ ~ +70℃ Ac Si Temperature Humidity Operating：10 ~ 95% (Non-Condensing) Storage：5 ~ 95% (Non-Condensing) Dimension 18 mm x 15 mm x 1.
2. Electrical Characteristics Absolute Maximum Ratings 3.3VD 3.3VD_RF 2-2. Typ. Max. Unit Supply Voltage -0.3 3.3 3.6 V Supply Voltage (RF) -0.3 3.3 3.6 V Recommended Operating Range Symbol Parameter 3.3VD Supply Voltage (RF) VIL VIH Parameter Input Low Voltage 2.97 Typ. Max. Unit 3.3 3.63 V 3.3 Output Low Voltage 3.63 V Conditions Min. Max. Unit LVTTL -0.28 0.6 V 2.0 3.63 V ︱IOL︱= 1.6~14mA -0.28 0.4 V Input High Voltage Ac Si VOL 2.
2-4. RF Characteristics 2-4-1. RF Characteristics for 802.11b 802.11b Transmit (Conductive) Condition Tx Power Level Channel 1 DQPSK Frequency Tolerance Spectral Mask Modulation Accuracy Typ. Max. Unit Channel 13 14 16 18 dBm -10 0 10 ppm 11MHz→22MHz 40 ＞22MHz 53 All Data Rate al Frequency Range Min. dBr dBr nti Item 15 % 802.11b Receiver (Conductive) Condition Frequency Range Min. Typ. Max. fid e Item Channel 1 11Mbps PER<8% Max.
2-4-3. RF Characteristics for 802.11n (2.4GHz) 802.11n_HT20 Transmit (Conductive) Item Condition Frequency range Min. Typ. Channel 1 Tx Power Level OFDM Frequency Tolerance Modulation Accuracy All Data Rate Max. Unit Channel 13 12 14 16 dBm -10 0 10 ppm -28 -30 dB 802.11n_HT40 Transmit (Conductive) Condition Typ. Channel 3 Tx Power Level OFDM 12 Frequency Tolerance -10 Modulation Accuracy All Data Rate -28 Max.
3. Pin Definition 3-1. Pin Description Definition I/O 1 GND VSS Ground Pin 2 GND VSS Ground Pin 3 GND VSS Ground Pin 4 3.
Pin Assignment and Footprint Ac Si PC on fid e nti al 3-2. Product Name Version Doc No Date Page AI7681H MT7681 802.
Mechanical Dimensions Ac Si PC on fid e nti al 3-3. Product Name Version Doc No Date Page AI7681H MT7681 802.
Ac Si PC on fid e nti al 4. Recommended Reflow Profile Product Name Version Doc No Date Page AI7681H MT7681 802.
5. Module Preparation 5-1. Handling Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti -static tray and packing. This protective package must be al remained in suitable environment until the module is assembled and soldered onto the main board. 5-2. nti Base on reliability test result pass MRT L3 criteria, AI7681H refer to MSL3 criterion. SMT Preparation fid e 1.
6. Package Information Ac Si PC on fid e nti al 6-1 Product Marking Product Name Version Doc No Date Page AI7681H MT7681 802.
Tray Dimension Ac Si PC on fid e nti al 6-2 Product Name Version Doc No Date Page AI7681H MT7681 802.
Packing Information 6-4 Humidity Indicator Card Ac Si PC on fid e nti al 6-3 Dry（乾燥） Wet（潮濕） Indicates 指示點： 5%, 10%, 60% relative humidity 5%, 10%, 60% 相對濕度 Color Change 顏色變化： Brown（Dry）→ Blue（Wet） 棕色（乾燥）→ 藍色（潮濕） Product Name Version Doc No Date Page AI7681H MT7681 802.
Federal Communication Commission Interference Statement Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. fid e - nti al This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part15 of the FCC Rules.
As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed al IMPORTANT NOTE In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product.
