Datasheet

Datasheet, Volume 1 15
Introduction
1.3 Power Management Support
1.3.1 Processor Core
• Full support of ACPI C-states as implemented by the following processor C-states:
— C0, C1, C1E, C3, C6
• Enhanced Intel SpeedStep
®
Technology
1.3.2 System
• Desktop Intel 5 Series Chipset platforms support: S0, S1, S3, S4, S5
• Workstation Intel 3400 Series Chipset platforms support: S0, S1, S3, S4, and S5
1.3.3 Memory Controller
• Conditional self-refresh (Intel
®
Rapid Memory Power Management (Intel
®
RMPM))
• Dynamic power-down
1.3.4 PCI Express*
• L0s and L1 ASPM power management capability.
1.4 Thermal Management Support
• Digital Thermal Sensor
•Intel
®
Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Thermal Throttling
• External Thermal Sensor
• Render Thermal Throttling
• Fan Speed Control with DTS
1.5 Package
• The processor socket type is noted as LGA 1156. The package is a 37.5 x 37.5 mm
Flip Chip Land Grid Array (FCLGA 1156).
1.6 Terminology
Term Description
BLT Block Level Transfer
CRT Cathode Ray Tube
DDR3 Third generation Double Data Rate SDRAM memory technology
DP Display Port*