Datasheet

Datasheet, Volume 1 5
4.2.1 Enhanced Intel
®
SpeedStep
®
Technology..................................................54
4.2.2 Low-Power Idle States ............................................................................55
4.2.3 Requesting Low-Power Idle States............................................................56
4.2.4 Core C-states ........................................................................................57
4.2.4.1 Core C0 State...........................................................................57
4.2.4.2 Core C1 / C1E State..................................................................57
4.2.4.3 Core C3 State...........................................................................57
4.2.4.4 Core C6 State...........................................................................57
4.2.4.5 Core C7 State...........................................................................58
4.2.4.6 C-State Auto-Demotion .............................................................58
4.2.5 Package C-States...................................................................................58
4.2.5.1 Package C0..............................................................................60
4.2.5.2 Package C1/C1E .......................................................................60
4.2.5.3 Package C3 State......................................................................60
4.2.5.4 Package C6 State......................................................................60
4.2.5.5 Package C7 State......................................................................61
4.2.5.6 Dynamic L3 Cache Sizing...........................................................61
4.3 Integrated Memory Controller (IMC) Power Management ........................................61
4.3.1 Disabling Unused System Memory Outputs ................................................61
4.3.2 DRAM Power Management and Initialization...............................................62
4.3.2.1 Initialization Role of CKE............................................................63
4.3.2.2 Conditional Self-Refresh ............................................................63
4.3.2.3 Dynamic Power Down Operation .................................................64
4.3.2.4 DRAM I/O Power Management....................................................64
4.3.3 DDR Electrical Power Gating (EPG) ...........................................................64
4.4 PCI Express* Power Management........................................................................65
4.5 DMI Power Management.....................................................................................65
4.6 Graphics Power Management ..............................................................................65
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)
(also known as CxSR).............................................................................65
4.6.2 Intel
®
Graphics Performance Modulation Technology (Intel
®
GPMT).............. 65
4.6.3 Graphics Render C-State.........................................................................66
4.6.4 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .................................. 66
4.6.5 Intel
®
Graphics Dynamic Frequency..........................................................66
4.6.6 Display Power Savings Technology 6.0 (DPST) ...........................................67
4.6.7 Automatic Display Brightness (ADB) .........................................................67
4.6.8 Intel
®
Seamless Display Refresh Rate Switching
Technology (Intel
®
SDRRS Technology) ....................................................67
4.7 Graphics Thermal Power Management..................................................................68
5 Thermal Management..............................................................................................69
5.1 Thermal Considerations......................................................................................69
5.2 Intel
®
Turbo Boost Technology Power Monitoring...................................................70
5.3 Intel
®
Turbo Boost Technology Power Control .......................................................70
5.3.1 Package Power Control............................................................................70
5.3.2 Power Plane Control................................................................................72
5.3.3 Turbo Time Parameter ............................................................................72
5.4 Configurable Thermal Design Power (cTDP) and
Low Power Mode (LPM) ......................................................................................72
5.4.1 Configurable TDP (cTDP).........................................................................72
5.4.2 Low Power Mode ....................................................................................73
5.5 Thermal and Power Specifications........................................................................74
5.6 Thermal Management Features ...........................................................................77
5.6.1 Adaptive Thermal Monitor........................................................................77
5.6.1.1 TCC Activation Offset ................................................................78
5.6.1.2 Frequency / Voltage Control.......................................................78
5.6.1.3 Clock Modulation ......................................................................80