Datasheet

Datasheet, Volume 1 19
Introduction
1.5 Package
The processor is available on two packages:
• A 37.5 x 37.5 mm rPGA package (rPGA988B)
• A 31 x 24 mm BGA package (BGA1023 for dual-core processors or BGA1224 for
quad-core processors)
1.6 Processor Compatibility
The Mobile 3rd Generation Intel
®
Core™ processor family has specific platform
requirements that differentiate it from a 2nd Generation Intel
®
Core™ processor family
mobile processor. Platforms intending to support both processor families need to
address the platform compatibility requirements detailed in Figure 1-2.
Notes:
1. 2G_Core = 2nd Generation Intel
®
Core™ processor family mobile
2. 3G_Core = Mobile 3rd Generation Intel
®
Core™ processor family
Figure 1-2. Mobile Processor Compatibility Diagram
2 x 330 µF
2 x 330 µF +
1 placeholder
VCCIO
VR
VDDQ
VR
VCore
VR
VCCSA
VR
VAXG
VR
DDR3
DDR3/3L
2G_Core: 1.5 V
3G_Core: 1.5 V or
1.35 V
2G_Core: 1.05 V
3G_Core: 1.05 V
VCCIO_SEL#
2G_Core: ‘1’
3G_Core: ‘0’
Need to be disconnected
To use same Voltage!
Mobile
Processor
PCH
VCCSA_VID [1:0]
PEG AC Decoupling
PEG Gen 1,2 – 100 nF
PEG Gen 1,2,3 – 220 nF
*VAXG: 2 ph required for
some SKUs
SVID
PROC_SELECT#
2G_Core: ‘1’
3G_Core: ‘0’
Controls DMI
and FDI
termination
DF_TVS
(* 1.35 V for
BGA DC only)