Technical information

Chapter 6 153
MEMORY
Memory SAMSUNG SO-DIMM DDRIII 1066 1GB
M471B2873EH1-CF8 LF 64*16 0.055um
KN.1GB0B.028
Memory ELPIDA SO-DIMM DDRIII 1066 2GB
EBJ21UE8BDS0-AE-F LF 128*8 0.065um
KN.2GB09.006
Memory SAMSUNG SO-DIMM DDRIII 1066 4GB
M471B5273BH1-CF8 LF 256*8 0.055um
KN.4GB0B.007
Memory ELPIDA SO-DIMM DDRIII 1333 1GB
EBJ10UE8BDS0-DJ-F LF 128*8 0.065um
KN.1GB09.015
Memory SAMSUNG SO-DIMM DDRIII 1333 1GB
M471B2873FHS-CH9 LF 128*8 46nm
KN.1GB0B.035
Memory NANYA SO-DIMM DDRIII 1333 2GB
NT2GC64B8HC0NS-CG LF 128*8 0.065um
KN.2GB03.017
Memory ELPIDA SO-DIMM DDRIII 1333 2GB
EBJ21UE8BDS0-DJ-F LF 128*8 0.065um
KN.2GB09.007
Memory SAMSUNG SO-DIMM DDRIII 1333 2GB
M471B5673FH0-CH9 LF 128*8 46nm
KN.2GB0B.023
Memory ELPIDA SO-DIMM DDRIII 1333 4GB
EBJ41UF8BAS0-DJ-F LF 256*8 0.055um
KN.4GB09.001
Memory SAMSUNG SO-DIMM DDRIII 1333 4GB
M471B5273CH0-CH9 LF 256*8 46nm
KN.4GB0B.010
Memory HYNIX SO-DIMM DDRIII 1333 1GB
HMT112S6TFR8C-H9 LF 128*8 0.055um
KN.1GB0G.026
Memory KINGSTON SO-DIMM DDRIII 1333 2GB
ACR256X64D3S1333C9 LF 128*8 0.065um
KN.2GB07.004
Memory HYNIX SO-DIMM DDRIII 1333 2GB
HMT125S6TFR8C-H9 LF 128*8 0.055um
KN.2GB0G.016
HEATSINK
THERMAL MODULE 35W FOR DIS 60.TWC07.008
THERMAL MODULE 35W FOR UMA 60.TWC07.009
HEAT SINK 33.TWG07.002
SPEAKER
SPEAKER SET (W/ L/R) 23.TWC07.001
MISCELLANEOUS
RUBBER - LCD BEZEL TOP 47.TWC07.001
RUBBER - LCD BEZEL SIDE 47.TWC07.002
RUBBER FOOT - BASE 47.TWC07.003
RUBBER - UPPER CASE 47.TWC07.004
LCD BEZEL SCREW MYLAR 47.TVM07.008
MYLAR FOR NON SIM CARD 47.TWC07.005
BLUETOOTH MYLAR 47.TWC07.006
CATEGORY PARTNAME P/N