Datasheet

Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1 95
Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.6.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in Table 2-2. The Intel Xeon processor 5500 series may
be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1. Intel Xeon processor 5500 series Standard/Basic SKUs processor Thermal Profile is representative of a
volumetrically constrained platform. Please refer to Table 6-7 for discrete points that constitute the thermal
profile.
2. Implementation of Intel Xeon processor 5500 series Standard/Basic SKUs Thermal Profile should result in
virtually no TCC activation.
3. Refer to the Intel® Xeon® Processor 5500 Series Thermal / Mechanical Design Guide for system and
environmental implementation details.
Table 6-6. Intel Xeon Processor 5500 Series Standard/Basic SKUs Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 80 5 See Figure 6-3;
Table 6-7;
1, 2, 3, 4, 5
Figure 6-3. Intel Xeon Processor 5500 Series Standard/Basic SKUs Thermal Profile