Datasheet

Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1 93
Thermal Specifications
Notes:
1. Intel Xeon processor 5500 series Advanced SKU Thermal Profile A is representative of a volumetrically
unconstrained platform. Please refer to Table 6-4 for discrete points that constitute thermal profile A.
2. Implementation of Intel Xeon processor 5500 series Advanced SKU Thermal Profile A should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet Profile A will
result in increased probability of TCC activation and may incur measurable performance loss.
3. Intel Xeon processor 5500 series Advanced SKU Thermal Profile B is representative of a volumetrically
constrained platform. Please refer to Table 6-5 for discrete points that constitute thermal profile B.
4. Refer to the Intel® Xeon® Processor 5500 Series Thermal / Mechanical Design Guide for system and
environmental implementation details.
Figure 6-2. Intel Xeon Processor 5500 Series Advanced SKU Thermal Profile
40
45
50
55
60
65
70
75
80
85
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95
Power [W]
Tem
p
erature
[
C
]
TCASE_MAX is a thermal solution design
point. In actuality, units will not significantly
exceed TCASE_MAX_A due to TCC activation.
Thermal Profile B
Y = 0.244*p + 57.8