Datasheet

Thermal Specifications
92 Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the loadline specifications in Section 2.6.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in Table 2-2. The Intel Xeon processor 5500 series may
be shipped under multiple VIDs for each frequency.
5. FMB or Flexible Motherboard guidelines provide a design target for meeting all planned processor frequency
requirements.
Table 6-2. Intel Xeon Processor W5580 Thermal Profile
Power (W) T
CASE_MAX
(°C)
0 43.5
5 44.4
10 45.3
15 46.2
20 47.1
25 48.0
30 48.9
35.6 49.9
40 50.7
45 51.6
50 52.6
55 53.5
60 54.4
65 55.3
70 56.2
75 57.1
80 58.0
85 58.9
90 59.8
95 60.7
100 61.6
105 62.5
110 63.4
115 64.3
120 65.2
125 66.1
130 67.0
Table 6-3. Intel Xeon Processor 5500 Series Advanced SKU Thermal Specifications
Core
Frequency
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 95 5 See Figure 6-2; Table 6-4 1, 2, 3, 4, 5